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SSTV16859CKLF

13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR -40°C~85°C Specialty Logic IC 74SSTV Series 74SSTV16859 2.3V~2.7V 56-VFQFN Exposed Pad


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-SSTV16859CKLF
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 760
  • Description: 13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR -40°C~85°C Specialty Logic IC 74SSTV Series 74SSTV16859 2.3V~2.7V 56-VFQFN Exposed Pad (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Delivery Time

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tray
Series 74SSTV
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 2.3V~2.7V
Base Part Number 74SSTV16859
Number of Bits 13, 26
Logic Type Registered Buffer with SSTL_2 Compatible I/O for DDR

SSTV16859CKLF Overview


A packaging method that uses Tray is employed.A package called 56-VFQFN Exposed Pad contains it.For the device to function normally, voltage 2.3V~2.7V is supplied.It is a type of electronic part mounted in the way of Surface Mount.It is set to operate at a temperature of -40°C~85°C.Approximately 13, 26 bits of information can be stored in the memory.74SSTV series electronic parts share many similarities.In addition to its base part number 74SSTV16859, other related parts are available.

SSTV16859CKLF Features



SSTV16859CKLF Applications


There are a lot of Renesas Electronics America Inc. SSTV16859CKLF Specialty Logic ICs applications.

  • Remote controls
  • Copper and fiber optic cables connection network
  • Wireless access points
  • Thermal management
  • Broadcast application
  • transmission relay
  • Solenoids
  • Vehicle, ship, aircraft navigation and positioning
  • Wireless projection application for conferences and business talks
  • Long-distance fiber optic network applications