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  • SSTVA16859BKLF

SSTVA16859BKLF

13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVA16859 2.3V~2.7V 56-VFQFN Exposed Pad


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-SSTVA16859BKLF
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 385
  • Description: 13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVA16859 2.3V~2.7V 56-VFQFN Exposed Pad (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case 56-VFQFN Exposed Pad
Operating Temperature 0°C~70°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 2.3V~2.7V
Base Part Number 74SSTVA16859
Number of Bits 13, 26
Logic Type Registered Buffer with SSTL_2 Compatible I/O for DDR
Mounting Type Surface Mount

SSTVA16859BKLF Overview


Packaging is done using Tray.The package 56-VFQFN Exposed Pad includes it.It is essential that the device be able to operate normally by supplying a voltage of 2.3V~2.7V.A Surface Mount mounting method is used for mounting electronic parts.It is set to operate at a temperature of 0°C~70°C.Using the memory, information is stored in 13, 26 bits.Using the base part number 74SSTVA16859, it is possible to locate a number of related parts.

SSTVA16859BKLF Features



SSTVA16859BKLF Applications


There are a lot of Renesas Electronics America Inc. SSTVA16859BKLF Specialty Logic ICs applications.

  • Military satellite communications
  • Precision geodetic measurement
  • Wireless multimedia center in smart home
  • interconnection between computers
  • Fiber optic cable connection network
  • Automation systems
  • IP cameras
  • Wireless projection application for conferences and business talks
  • Fiber distributed data interface (FDDI)
  • Laser diode bonding