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  • SSTVF16857AGLFT

SSTVF16857AGLFT

14 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVF Series 74SSTVF16857 2.3V~2.7V 48-TFSOP (0.240, 6.10mm Width)


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-SSTVF16857AGLFT
  • Package: 48-TFSOP (0.240, 6.10mm Width)
  • Datasheet: PDF
  • Stock: 221
  • Description: 14 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVF Series 74SSTVF16857 2.3V~2.7V 48-TFSOP (0.240, 6.10mm Width) (Kg)

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Shipping Cost

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.240, 6.10mm Width)
Supplier Device Package 48-TSSOP
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Series 74SSTVF
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Supply Voltage 2.3V~2.7V
Base Part Number 74SSTVF16857
Number of Bits 14
Logic Type Registered Buffer with SSTL_2 Compatible I/O for DDR

SSTVF16857AGLFT Overview


Using Tape & Reel (TR) as a packaging method is common.You can find it in the 48-TFSOP (0.240, 6.10mm Width) package.In order for the device to perform properly, a voltage of 2.3V~2.7V is supplied.Electronic parts mounted using the Surface Mount method.Temperature 0°C~70°C is set as operating temperature.Memory has a bit size of 14.74SSTVF series electronic parts are similar in many ways.On the basis of its base part number 74SSTVF16857, several related parts can be found.

SSTVF16857AGLFT Features



SSTVF16857AGLFT Applications


There are a lot of Renesas Electronics America Inc. SSTVF16857AGLFT Specialty Logic ICs applications.

  • Copper and fiber optic cables connection network
  • Remote controls
  • Wireless access points
  • Solenoids
  • Vehicle, ship, aircraft navigation and positioning
  • Wireless modems
  • Structural bonding
  • Broadcast application
  • Precision geodetic measurement
  • Indoor ad hoc meeting