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  • SSTVF16859BKLF

SSTVF16859BKLF

13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVF Series 74SSTVF16859 2.3V~2.7V 56-VFQFN Exposed Pad


  • Manufacturer: Renesas Electronics America Inc.
  • Origchip NO: 668-SSTVF16859BKLF
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: -
  • Stock: 892
  • Description: 13, 26 Bit Registered Buffer with SSTL_2 Compatible I/O for DDR 0°C~70°C Specialty Logic IC 74SSTVF Series 74SSTVF16859 2.3V~2.7V 56-VFQFN Exposed Pad (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 56-VFQFN Exposed Pad
Operating Temperature 0°C~70°C
Packaging Tray
Series 74SSTVF
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Supply Voltage 2.3V~2.7V
Base Part Number 74SSTVF16859
Number of Bits 13, 26
Logic Type Registered Buffer with SSTL_2 Compatible I/O for DDR

SSTVF16859BKLF Overview


In packaging, Tray is used.It is included in package 56-VFQFN Exposed Pad.In order to ensure that the device will work normally, the voltage 2.3V~2.7V is supplied.Basically, it is an electronic part mounted with Surface Mount.This device operates at a temperature of 0°C~70°C.Memory features a storage capacity of 13, 26 bits.Electronic parts from the 74SSTVF series share a number of similarities.Based on its base part number 74SSTVF16859, related parts can be found.

SSTVF16859BKLF Features



SSTVF16859BKLF Applications


There are a lot of Renesas Electronics America Inc. SSTVF16859BKLF Specialty Logic ICs applications.

  • Wireless HD Photography
  • Structural bonding
  • Remote controls
  • Desktop radio
  • Relays
  • Cordless telephone
  • Fiber distributed data interface (FDDI)
  • Sensor reporting
  • Telecom and datacom networking applications
  • Thermal management