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STAC9753XXTAEB2X

STAC9753XXTAEB2X datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-STAC9753XXTAEB2X
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 891
  • Description: STAC9753XXTAEB2X datasheet pdf and Interface - CODECs product details from Integrated Device Technology (IDT) stock available at Utmel(Kg)

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Details

Tags

Parameters
Mount Surface Mount
Package / Case TQFP
Number of Pins 48
Published 2006
JESD-609 Code e3
Moisture Sensitivity Level (MSL) 3
Number of Terminations 48
Type General Purpose
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Terminal Position QUAD
Terminal Form GULL WING
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Temperature Grade COMMERCIAL
Interface Serial
Resolution 2.5 B
Sampling Rate 48 ksps
Number of A/D Converters 2
Filter YES
Height Seated (Max) 1.6mm
Length 7mm
Width 7mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free

STAC9753XXTAEB2X Overview


Space-saving is achieved by supplying it in the TQFP package. This electronic part is categorized as a type of General Purpose, making it capable of providing high-efficiency performance in a variety of applications. Transmission lines have 48 terminations, which prevent signals from re-emitted. In electronic terms, it is a kind of 48-pin device. On a PCB based on Surface Mount technology, it is mounted. It is possible to convert analog signals into digital signals using 2 A/D converters. There is no supply voltage for it. The operating temperature is set with the maximum value of 70°C to keep normal use. To maintain normal use, the operating temperature is set to 0°C.

STAC9753XXTAEB2X Features


Embedded in the TQFP package
2 A/D converters

STAC9753XXTAEB2X Applications


There are a lot of Integrated Device Technology (IDT) STAC9753XXTAEB2X CODECs Interface ICs applications.

  • Spooling or level wind
  • Automation
  • Metal forming & fabrication
  • Missing value imputation
  • Subtraction
  • High-performance memory systems
  • Packaging
  • Image compression
  • Off-Highway Vehicles (OHV)
  • Printing