English

All Products

View All >>
  • TC74ACT244P(F)

TC74ACT244P(F)

TC74ACT244P(F) datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Toshiba stock available at Utmel


  • Manufacturer: Toshiba
  • Origchip NO: 4669-TC74ACT244P(F)
  • Package: DIP
  • Datasheet: PDF
  • Stock: 713
  • Description: TC74ACT244P(F) datasheet pdf and Logic - Buffers, Drivers, Receivers, Transceivers product details from Toshiba stock available at Utmel(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mount Through Hole
Package / Case DIP
Number of Pins 20
Published 1996
Part Status Active
Number of Terminations 20
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory Bus Driver/Transceivers
Packing Method TUBE
Technology CMOS
Terminal Position DUAL
Number of Functions 2
Supply Voltage 5V
Qualification Status Not Qualified
Number of Elements 2
Polarity Non-Inverting
Power Supplies 5V
Temperature Grade INDUSTRIAL
Max Supply Voltage 5.5V
Min Supply Voltage 4.5V
Load Capacitance 50pF
Number of Bits 8
Propagation Delay 8 ns
Logic Function Buffer, Inverting
Output Characteristics 3-STATE
Logic IC Type BUS DRIVER
Number of Bits per Element 4
Prop. Delay@Nom-Sup 9 ns
High Level Output Current 24mA
Low Level Output Current 24mA
Control Type ENABLE LOW
Height 3.5mm
Length 24.6mm
Width 6.4mm
RoHS Status RoHS Compliant
Lead Free Lead Free

TC74ACT244P(F) Overview


Logical driver uses a neat DIP package. All of the 2 elements are put into use. 20 terminations with different functions. Buffer IC reuqires a supply voltage of 5V. Buffer IC is suitable for Through Hole applications. Logical driver has 20 pins. The bus transceiver employs 4 bits for each element. Specifically, digital transciever is a kind of Bus Driver/Transceivers. The digital buffer starts up under ENABLE LOW control technology. It is recommended to use a 5V power supply. It is generally sold in TUBE package. 8 bits are included within the electrical component. Voltage buffer is capable of operating under temperature as low as -40°C. Digital buffer should operate with ambient temperature no higher than 85°C. Buffer driver outputs 24mA to its low level. In high level output mode, the electronic parts may conduct 24mA of current. Voltage used to run voltage buffer should be 4.5V at least. In regard to the maximum supply voltage, buffer driver is rated 5.5V. It is known as a BUS DRIVER logic IC.

TC74ACT244P(F) Features


Bus Driver/Transceivers
High Level Output: 24mA
Low Level Output: 24mA
BUS DRIVER Logic IC

TC74ACT244P(F) Applications


There are a lot of Toshiba TC74ACT244P(F) Buffers & Transceivers applications.

  • Home theater wiring-free
  • Gigabit Ethernet
  • Automation systems
  • Satellite ground stations
  • Relays
  • Wireless smart house
  • Carrier phase observations
  • Optical sub-assembly (OSA)
  • Radio transmission
  • SONET/SDH Network