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TCM37C15AIN

TCM37C15AIN datasheet pdf and Interface - CODECs product details from Rochester Electronics, LLC stock available at Utmel


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TCM37C15AIN
  • Package: 20-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 925
  • Description: TCM37C15AIN datasheet pdf and Interface - CODECs product details from Rochester Electronics, LLC stock available at Utmel(Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 20-DIP (0.300, 7.62mm)
Surface Mount NO
Operating Temperature -40°C~85°C
Packaging Tube
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Type PCM Codec/Filter
Technology CMOS
Terminal Position DUAL
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 2.54mm
Pin Count 20
JESD-30 Code R-PDIP-T20
Qualification Status COMMERCIAL
Voltage - Supply, Analog ±5V
Sigma Delta No
Filter YES
Companding Law A-LAW
Neg Supply Voltage-Nom -5V
Height Seated (Max) 5.08mm
Length 24.325mm
Width 7.62mm
RoHS Status Non-RoHS Compliant

TCM37C15AIN Overview


A 20-DIP (0.300, 7.62mm) package is supplied for space savings. We have adopted the packaging method of Tube. It can perform highly efficiently in various applications since it is a type of PCM Codec/Filter. Mounting type Through Hole is used. At -40°C~85°C, it can operate normally. The analog circuit is powered by ±5V. Signals are prevented from reflecting off the end of transmission lines by 20 terminations. It has a configuration of 20 pins. A voltage of 5V is required to operate the device. It is important to note that the supply voltage -5V has more negative polarity than the ground.

TCM37C15AIN Features


Embedded in the 20-DIP (0.300, 7.62mm) package
Operating temperature of -40°C~85°C

TCM37C15AIN Applications


There are a lot of Rochester Electronics, LLC TCM37C15AIN CODECs Interface ICs applications.

  • Packaging
  • Material handling
  • Anomaly detection
  • Galvanometer scanners
  • Radiation therapy
  • Robotic arms
  • Conveying
  • Aerospace
  • Filling
  • Dimensionality reduction