All Products

TDA3608TH/N3C,512

20 Terminations9.5V~18V TDA3608 Specialized Power Management ICs500μA 1 Functions


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-TDA3608TH/N3C,512
  • Package: 20-SOIC (0.433, 11.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: 840
  • Description: 20 Terminations9.5V~18V TDA3608 Specialized Power Management ICs500μA 1 Functions(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 20-SOIC (0.433, 11.00mm Width) Exposed Pad
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tube
Published 2001
JESD-609 Code e4
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 20
Terminal Finish SILVER
Applications Processor
HTS Code 8542.31.00.01
Voltage - Supply 9.5V~18V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 14.4V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number TDA3608
Pin Count 20
JESD-30 Code R-PDSO-G20
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 18V
Supply Voltage-Min (Vsup) 9.5V
Analog IC - Other Type ANALOG CIRCUIT
Current - Supply 500μA
Height Seated (Max) 3.5mm
Length 15.9mm
Width 11mm
RoHS Status ROHS3 Compliant

TDA3608TH/N3C,512 Overview


The way of Tube is acceptable for shipping the power management.packaged the power management in 20-SOIC (0.433, 11.00mm Width) Exposed Pad for ease of transportation, it is easy to transport.For ease of adaptability, Surface Mount is an universal mounting method.There are a number of applications targeted at Processor .The operating temperature of the power management ic should be set to -40°C~85°C to avoid mal-function.As a result, this power management is powered by 9.5V~18V voltage.You can find more power ic's pin-to-pin solutions by searching TDA3608 .It has 20 terminals.The instruments designs is highly regarded as a ANALOG CIRCUIT analog IC.In addition to being supplied by the 14.4V voltage, the power manager is capable of performing many demanding tasks.This power ic has 20 pins starting from the pinout.Current should be conducted at 500μA when the power ic is supplied with power.A minimum of 9.5V is required for the ic supplies to start.You are not supposed to feed the power supply ic with voltage higher than 18V .

TDA3608TH/N3C,512 Features


Mainly used in Processor applications
Operating temperature: -40°C~85°C
ANALOG CIRCUIT analog IC

TDA3608TH/N3C,512 Applications


There are a lot of NXP USA Inc. TDA3608TH/N3C,512Power Management applications.

  • Docking station
  • Industrial Telemetry Applications
  • SSTL-3
  • Printers
  • Automotive Digital Cluster
  • SmartPhones
  • Automotive Infotainment
  • Optical imaging payload
  • LTE modem
  • Base Station Power Distribution Systems