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TDA3681TH/N2S,518

9.5V~18V TDA3681 Specialized Power Management ICs110μA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-TDA3681TH/N2S,518
  • Package: 20-SOIC (0.433, 11.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: 668
  • Description: 9.5V~18V TDA3681 Specialized Power Management ICs110μA (Kg)

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Details

Tags

Parameters
Factory Lead Time 14 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.433, 11.00mm Width) Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2003
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications Ignition Buffer, Regulator
Voltage - Supply 9.5V~18V
Base Part Number TDA3681
Current - Supply 110μA
RoHS Status ROHS3 Compliant

TDA3681TH/N2S,518 Overview


Ready for shipping the power management in Tape & Reel (TR) package.Packing in 20-SOIC (0.433, 11.00mm Width) Exposed Pad makes transportation convenient.The Surface Mount mounting method allows for easy adaptation.It is intended to be used at Ignition Buffer, Regulator as well as for other applications.Ensure that the operating temperature of the power management ic is set to -40°C~85°C in order to prevent malfunctions.This power management uses 9.5V~18V voltage for work.Search TDA3681 to find more power ic's pin-to-pin solutions.A supply current of 110μA should be applied to the power ic.

TDA3681TH/N2S,518 Features


Mainly used in Ignition Buffer, Regulator applications
Operating temperature: -40°C~85°C

TDA3681TH/N2S,518 Applications


There are a lot of NXP USA Inc. TDA3681TH/N2S,518Power Management applications.

  • HSTL Termination
  • SSTL-3 Termination
  • Space satellite point of load supply
  • Desktop PC
  • Base Station Power Distribution Systems
  • LTE modem
  • Field Service
  • SSTL-2 WHITE SPACE
  • FPGA
  • Wireless routers