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TLV320AC56CDW

TLV320AC56CDW datasheet pdf and Interface - CODECs product details from Texas Instruments stock available at Utmel


  • Manufacturer: Texas Instruments
  • Origchip NO: 815-TLV320AC56CDW
  • Package: SOIC
  • Datasheet: -
  • Stock: 788
  • Description: TLV320AC56CDW datasheet pdf and Interface - CODECs product details from Texas Instruments stock available at Utmel(Kg)

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Details

Tags

Parameters
Package / Case SOIC
Surface Mount YES
Number of Pins 20
Pbfree Code no
Number of Terminations 20
HTS Code 8542.39.00.01
Subcategory Codecs
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 20
Qualification Status Not Qualified
Operating Temperature (Max) 70°C
Power Supplies 3V
Temperature Grade COMMERCIAL
Supply Current-Max 0.0075mA
Sampling Rate 16 ksps
Telecom IC Type BASEBAND CIRCUIT
Filter YES
Companding Law MU-LAW
Gain Tolerance-Max 1dB
Linear Coding 13-BIT
Height Seated (Max) 2.65mm
Length 12.8mm
Width 7.5mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

TLV320AC56CDW Overview


Space-saving reasons have led to it being packaged in a SOIC package. In order to prevent signal reflections from off the end of the transmission line, 20 terminations are used. Essentially, it is an electronic device with 20 pins. There are 20 pins on this board. Subcategory Codecs describes this electronic part. This device operates on 3V volts as its supply voltage. Power supplies of 3V are used. Temperatures above 70°C shouldn't be exceeded during operation. It's easy to operate them when the supply current is kept below 0.0075mA.

TLV320AC56CDW Features


Embedded in the SOIC package

TLV320AC56CDW Applications


There are a lot of Texas Instruments TLV320AC56CDW CODECs Interface ICs applications.

  • Half adders
  • Material handling
  • Autonomous vehicles & robots
  • Linear measurement
  • Conveying
  • Wire number reduction in application that have multiple inputs
  • Missing value imputation
  • Multiplication
  • Dimensionality reduction
  • Semiconductor fabrication