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TMS320BC53PQ57

CPLD TMS320C5x Series 132-BQFP Bumpered


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TMS320BC53PQ57
  • Package: 132-BQFP Bumpered
  • Datasheet: PDF
  • Stock: 361
  • Description: CPLD TMS320C5x Series 132-BQFP Bumpered (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 132-BQFP Bumpered
Supplier Device Package 132-BQFP (24.54x24.54)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series TMS320C5x
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Type Fixed Point
Interface BSP, SSP, TDM
Voltage - I/O 5.00V
Non-Volatile Memory ROM (32kB)
Voltage - Core 5.00V
On Chip Data RAM 8kB
Clock Rate 57MHz
RoHS Status ROHS3 Compliant

TMS320BC53PQ57 Overview


An electronic component available in package 132-BQFP Bumpered.A packaging way of Tray is provided.Due to its membership in Fixed Point, it is ideally suited for a wide range of uses.The mounting is carried out in the direction of Surface Mount.At the temperature of 0°C~70°C TA, the device is guaranteed to operate normally.The analog voltage range of 5.00V refers to the input or output voltage.TMS320C5x series digital signal processors contain this digital signal processor.

TMS320BC53PQ57 Features


Supplied in the 132-BQFP Bumpered package

TMS320BC53PQ57 Applications


There are a lot of Rochester Electronics, LLC TMS320BC53PQ57 DSP applications.

  • Speech signal processing
  • Medical imaging
  • Geoscience signal processing
  • Monitoring equipment
  • Seismology
  • Image signal processing
  • Tomography technology
  • Instrument modeling
  • Other sensor array processing
  • Finite impulse response digital filters