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TMS320C6472ECTZ6

0.8mm 1.11.83.3V CPLD 1.1V FCBGA


  • Manufacturer: Texas Instruments
  • Origchip NO: 815-TMS320C6472ECTZ6
  • Package: FCBGA
  • Datasheet: -
  • Stock: 736
  • Description: 0.8mm 1.11.83.3V CPLD 1.1V FCBGA (Kg)

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Details

Tags

Parameters
Package / Case FCBGA
Surface Mount YES
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 4
Number of Terminations 737
ECCN Code 3A001.A.3
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Subcategory Digital Signal Processors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 737
JESD-30 Code S-PBGA-B737
Qualification Status Not Qualified
Operating Temperature (Max) 85°C
Supply Voltage-Max (Vsup) 1.16V
Power Supplies 1.11.83.3V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.05V
RAM Size 768kB
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Bit Size 32
Frequency (Max) 625MHz
Data Bus Width 32b
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
RAM (words) 8192
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Height Seated (Max) 3.242mm
Length 24mm
RoHS Status RoHS Compliant
Lead Free Lead Free

TMS320C6472ECTZ6 Overview


It is a kind of electronic component available in the FCBGA package.The 737 terminations are used for its uses.The voltage supplied by 1.1V is used to operate it.Pins are present on the 737 component.According to its specific characteristics, this device is classified in the subcategory Digital Signal Processors.1.11.83.3V electric power supplies it.The uPs/uCs/peripheral ICs of the device employ the DIGITAL SIGNAL PROCESSOR, OTHER type.Keep its frequency below 625MHz at all times.Operating temperatures should not exceed 85°C.

TMS320C6472ECTZ6 Features


Supplied in the FCBGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

TMS320C6472ECTZ6 Applications


There are a lot of Texas Instruments TMS320C6472ECTZ6 DSP applications.

  • Electronic information engineering
  • Speech processing
  • Biomedical engineering
  • Digital image processing, data compression
  • Computer vision technology
  • Streaming videos
  • Seismology
  • Scene analysis technology
  • Audio synthesis
  • Image compression