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  • TMS320C6748BZCE3

TMS320C6748BZCE3

CPLD TMS320C674x Series 361-LFBGA


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TMS320C6748BZCE3
  • Package: 361-LFBGA
  • Datasheet: -
  • Stock: 645
  • Description: CPLD TMS320C674x Series 361-LFBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 361-LFBGA
Supplier Device Package 361-NFBGA (13x13)
Operating Temperature 0°C~90°C TJ
Packaging Tray
Series TMS320C674x
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Fixed/Floating Point
Interface EBI/EMI, Ethernet MAC, Host Interface, I2C, McASP, SPI, UART, USB
Voltage - I/O 1.8V 3.3V
Non-Volatile Memory External
Voltage - Core 1.20V
On Chip Data RAM 448kB
Clock Rate 375MHz
RoHS Status ROHS3 Compliant

TMS320C6748BZCE3 Overview


This is an electronic component with a 361-LFBGA package.It has a packaging style of Tray.Fixed/Floating Point members are well suited for a wide range of applications.The mounting is carried out in the direction of Surface Mount.It is essential that 0°C~90°C TJ is kept at a temperature that ensures proper operation of the machine.This refers to the analog voltage range that can be input or output from 1.8V 3.3V.The TMS320C674x series incorporates this digital signal processor.

TMS320C6748BZCE3 Features


Supplied in the 361-LFBGA package

TMS320C6748BZCE3 Applications


There are a lot of Rochester Electronics, LLC TMS320C6748BZCE3 DSP applications.

  • TVs
  • Scene analysis technology
  • Speech processing
  • Instrument modeling
  • Speech processing and recognition
  • Other sensor array processing
  • Tomography technology
  • 3D tomography and imaging processing
  • Processing system
  • Image signal processing