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TMS320DM355CZCE270

CPLD TMS320DM3x, DaVinci? Series 337-LFBGA


  • Manufacturer: Rochester Electronics, LLC
  • Origchip NO: 699-TMS320DM355CZCE270
  • Package: 337-LFBGA
  • Datasheet: -
  • Stock: 391
  • Description: CPLD TMS320DM3x, DaVinci? Series 337-LFBGA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 337-LFBGA
Supplier Device Package 337-NFBGA (13x13)
Operating Temperature 0°C~85°C TC
Packaging Tube
Series TMS320DM3x, DaVinci™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Digital Media System-on-Chip (DMSoC)
Interface ASP, I2C, SPI, UART, USB
Voltage - I/O 1.8V 3.3V
Non-Volatile Memory ROM (8kB)
Voltage - Core 1.30V
On Chip Data RAM 56kB
Clock Rate 270MHz
RoHS Status Non-RoHS Compliant

TMS320DM355CZCE270 Overview


It is a type of electronic component available in package 337-LFBGA.Tube is the packaging method provided.Digital Media System-on-Chip (DMSoC)'s wide range of applications makes it ideal for a wide variety of applications.The mounting is carried out in the direction of Surface Mount.Operating at the temperature of 0°C~85°C TC ensures its normal operation.The analog voltage range of 1.8V 3.3V refers to the voltage that can be input or ouput.Digital signal processors such as this one are included in the TMS320DM3x, DaVinci? series.

TMS320DM355CZCE270 Features


Supplied in the 337-LFBGA package

TMS320DM355CZCE270 Applications


There are a lot of Rochester Electronics, LLC TMS320DM355CZCE270 DSP applications.

  • Spectral density estimation
  • Biometrics
  • Biomedical treatment
  • Infrared
  • Control systems
  • Video coding, audio coding
  • Digital image processing, data compression
  • House construction
  • Seismology
  • Geoscience signal processing