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TMS32C6211B1GFN150

1.27mm CPLD 1.8V BGA


  • Manufacturer: Texas Instruments
  • Origchip NO: 815-TMS32C6211B1GFN150
  • Package: BGA
  • Datasheet: -
  • Stock: 574
  • Description: 1.27mm CPLD 1.8V BGA (Kg)

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Shipping Cost

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case BGA
Surface Mount YES
Pbfree Code no
Number of Terminations 256
ECCN Code 3A001.A.3
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Pin Count 256
Supply Voltage-Max (Vsup) 1.89V
Supply Voltage-Min (Vsup) 1.71V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Clock Frequency 150MHz
Address Bus Width 20
Boundary Scan YES
Low Power Mode NO
External Data Bus Width 32
Format FIXED POINT
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Height Seated (Max) 2.32mm
Length 27mm
Width 27mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

TMS32C6211B1GFN150 Overview


This is an electronic component with a BGA package.There are 256 terminations for its uses.It is supplied with voltage by 1.8V.There are pins on the 256 component.This system uses DIGITAL SIGNAL PROCESSOR, OTHER as its uPs, uCs, and peripheral ICs.With a clock frequency of 150MHz, it operates.

TMS32C6211B1GFN150 Features


Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

TMS32C6211B1GFN150 Applications


There are a lot of Texas Instruments TMS32C6211B1GFN150 DSP applications.

  • Speech processing
  • Fourier transform
  • Telephone conversations
  • Infrared
  • 3D tomography and imaging processing
  • Digital hardware
  • Control systems
  • Vibration signal processing
  • Electronic information engineering
  • Audio