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TSE2002GB2A1NCG

DFN Thermal Management 2mm mmLead Free


  • Manufacturer: Integrated Device Technology (IDT)
  • Origchip NO: 378-TSE2002GB2A1NCG
  • Package: DFN
  • Datasheet: PDF
  • Stock: 490
  • Description: DFN Thermal Management 2mm mmLead Free (Kg)

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Shipping Cost

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mount Surface Mount
Package / Case DFN
Number of Pins 8
Published 2004
JESD-609 Code e3
Pbfree Code yes
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 125°C
Min Operating Temperature -20°C
Pin Count 8
Output Type Digital, I2C
Interface 2-Wire, I2C, SMBus
Termination Type SOLDER
Operating Supply Current 700μA
Number of Bits 12
Resolution 1 B
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Max Supply Voltage (DC) 3.6V
Min Supply Voltage (DC) 2.3V
Accuracy-Max 3 Cel
Length 2mm
Width 3mm
Thickness 750μm
RoHS Status RoHS Compliant
Lead Free Lead Free

TSE2002GB2A1NCG Overview


Its output type is Digital, I2C.Its low package cost makes it appealing to electronic industry professionals.In addition, it has 8 pins. 12 bits information can be stored.For miniming reflections and power losses, it uses SOLDER termination type.At 1 B, we can distinguish between two points on a waveform, which measures the distance in amplitude between them.Thermal management operates on 700μA current.Supply Voltage (DC) maximum is 3.6V.Thermal management operates wThermal managementh the minimum Supply Voltage (DC) of 2.3V.To avoid unnecessary costs, the Operating Temperature should not exceed 125°C. The Operating Temperature should be above -20°C to avoid uncessary cost.

TSE2002GB2A1NCG Features


Available in the DFN package
Operating supply current of 700μA

TSE2002GB2A1NCG Applications


There are a lot of Integrated Device Technology (IDT) TSE2002GB2A1NCG applications of thermal management.

  • General Purpose Temperature Datalog
  • Network Servers and Personal Computers
  • DIMM Modules for Servers, PCs, and Laptops
  • Telecomm Equipment
  • Multi-processor based equipment
  • Telecommunications
  • Notebooks
  • Graphics Cards
  • Projectors
  • DIMM Modules