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TZA3047BVH/C1,551

PMIC TZA3047 32-WFQFN Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-TZA3047BVH/C1,551
  • Package: 32-WFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 539
  • Description: PMIC TZA3047 32-WFQFN Exposed Pad (Kg)

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Shipping Cost

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 32-WFQFN Exposed Pad
Supplier Device Package 32-HBCC (5x5)
Operating Temperature -40°C~85°C
Packaging Tray
Published 2002
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Type Laser Diode Driver (Fiber Optic)
Voltage - Supply 3.14V~3.47V
Base Part Number TZA3047
Number of Channels 1
Current - Supply 40mA
Data Rate 1.25Gbps
Current - Modulation 100mA
Current - Bias 100mA
RoHS Status ROHS3 Compliant

TZA3047BVH/C1,551 Overview


In accordance with the specifications provided by Tray.There is no doubt that the 32-WFQFN Exposed Pad is the most cost-effective package in the electronics industry.The product qualifies as Type Laser Diode Driver (Fiber Optic) for standard grade applications.A quality output is achieved by combining 1 channels.A 3.14V~3.47V Supply Voltage is provided so that normal operation can be ensured.A Surface Mount-shape is used to mount it on the PCB.Efficiencies are achieved by operating at -40°C~85°C temperature.Find related parts using the Base Part Number TZA3047.40mA is used to supply the current needed by this system.Typically, the "Supplier Device Package" of 32-HBCC (5x5) contains alternate names, pseudo-standard names, and manufacturers' custom names.

TZA3047BVH/C1,551 Features


Supplied in the 32-WFQFN Exposed Pad package
Operating temperature of -40°C~85°C

TZA3047BVH/C1,551 Applications


There are a lot of NXP USA Inc. TZA3047BVH/C1,551 Laser Driver ICs applications.

  • Set top boxes
  • Measurement and control euipment
  • Blower
  • Signal chain
  • Engine management
  • Communication device
  • SoC
  • ADAS (Advanced Driver-Assistance System)
  • Industrial equipment
  • HMI (Human-Machine Interface)