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UCC39151DP

1 Hot Swap Controllers SOIC 1


  • Manufacturer: Texas Instruments
  • Origchip NO: 815-UCC39151DP
  • Package: SOIC
  • Datasheet: -
  • Stock: 754
  • Description: 1 Hot Swap Controllers SOIC 1 (Kg)

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Details

Tags

Parameters
Package / Case SOIC
Surface Mount YES
Pbfree Code no
Number of Terminations 16
ECCN Code EAR99
Max Operating Temperature 70°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Subcategory Power Management Circuits
Technology BICMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 12V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 16
JESD-30 Code R-PDSO-G16
Qualification Status Not Qualified
Power Supplies 12V
Temperature Grade COMMERCIAL
Number of Channels 1
Max Supply Voltage 15V
Min Supply Voltage 7V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Nominal Supply Current 2mA
Adjustable Threshold YES
Height Seated (Max) 1.75mm
Length 9.9mm
Width 3.9mm
RoHS Status RoHS Compliant
Lead Free Contains Lead

UCC39151DP Overview


It's included in the SOIC package.At present, 1 channels are available.Hot-swappable device has a total of 16 terminations.This device has a terminal position of DUAL.There are a total of 16 pins on it.High efficiency can be achieved with a voltage supply of 12V.There is nothing else in Power Management Circuits but this gadget.Operating at 70°C°C allows for stable operation.Hot-swappable device operates at a minimum temperature of 0°C degrees Celsius in order to ensure reliabilHot-swappable devicey.In terms of power supplies, it is the character 12V that appears on the part.An analog IC, in this case POWER SUPPLY SUPPORT CIRCUIT, is used in this gadget.A maximum supply voltage of 15VV can be handled by it.With 7VV, it can work with the lowest supply voltage possible.

UCC39151DP Features


The terminal position of 16

UCC39151DP Applications


There are a lot of Texas Instruments UCC39151DP hot swap controllers applications.

  • Other forms of communications infrastructure
  • Thermal limitation
  • Industrial application
  • Electric vehicle
  • Loads
  • Board or blade insertion into live backplanes
  • High power circuit board
  • Current monitoring
  • Current monitor output
  • Solid state circuit breakers