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UJA1131HW/3V3Y

2V~28V Specialized Power Management ICs2.8mA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-UJA1131HW/3V3Y
  • Package: 48-TQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 127
  • Description: 2V~28V Specialized Power Management ICs2.8mA (Kg)

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 48-TQFP Exposed Pad
Operating Temperature -40°C~125°C TA
Packaging Tape & Reel (TR)
Published 2013
Series Automotive, AEC-Q100
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications Automotive
Voltage - Supply 2V~28V
Current - Supply 2.8mA
RoHS Status ROHS3 Compliant

UJA1131HW/3V3Y Overview


Tape & Reel (TR) is an acceptable method of shipping the power management.It is packaged the power management in 48-TQFP Exposed Pad for convenient transportation.For easy adaptation, Surface Mount is a universal mounting method.It targets applications such as Automotive and others.The operating temperature of the power management ic should be set to -40°C~125°C TA to avoid mal-function.The power management runs on 2V~28V voltage.It is recommended that the power ic receives its supply current at 2.8mA .You can search the similart manage icss based on Automotive, AEC-Q100 .

UJA1131HW/3V3Y Features


Mainly used in Automotive applications
Operating temperature: -40°C~125°C TA

UJA1131HW/3V3Y Applications


There are a lot of NXP USA Inc. UJA1131HW/3V3YPower Management applications.

  • Power Supplies
  • Automotive Advanced Driver Assistance System (ADAS)
  • Cluster
  • I/Os (FPGAs, ASICs, DSPs)
  • Debug
  • Memory Power
  • Camera Power Applications
  • Office Electronics
  • Storage Systems
  • Digital Cores