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VSC7421XJQ-02

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC7421XJQ-02
  • Package: TQFP
  • Datasheet: PDF
  • Stock: 596
  • Description: Telecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Factory Lead Time 6 Weeks
Lifecycle Status NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case TQFP
Supplier Device Package 302-TQFP (24x24)
Packaging Tray
Series SparX™-III-17um
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 125°C
Min Operating Temperature 0°C
Voltage - Supply 1V
Function Ethernet Switch
Interface Serial
Number of Circuits 1
Data Rate 1 Gbps
RoHS Status ROHS3 Compliant

VSC7421XJQ-02 Overview


TQFP package is used to save board space.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.This telecom IC is composed of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The SparX?-III-17um series is capable of providing a number of similar functions to the W series.Normal operation is ensured by setting 0°C to a minimum value.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.

VSC7421XJQ-02 Features


Available in the TQFP package

VSC7421XJQ-02 Applications


There are a lot of Microchip Technology VSC7421XJQ-02 Telecom applications.

  • ISDN terminal adapter
  • T1 Digital Cross Connects (DSX-1)
  • Short/Medium Loop
  • PCM Test Equipment
  • CSU/DSU E1/T1/J1 Interface
  • Interfaces to E3
  • Fiber in the loop (FITL)
  • T1/E1/J1 Performance Monitoring
  • High speed data transmission line cards
  • Integrated Multi-Service Access Platforms (IMAPs)