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VSC7422XJQ-04

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC7422XJQ-04
  • Package: TQFP
  • Datasheet: -
  • Stock: 132
  • Description: Telecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case TQFP
Supplier Device Package 302-TQFP (24x24)
Packaging Tray
Series SparX™-III-25um
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Voltage - Supply 1V
Function Ethernet Switch
Interface Serial
Number of Circuits 1
Data Rate 1 Gbps
Telecom IC Type SUPPORT CIRCUIT
RoHS Status ROHS3 Compliant

VSC7422XJQ-04 Overview


In order to save space on the board, TQFP packages are used.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.Telecommunications equipment consists of 1 circuits.The voltage supplied to 1V can improve efficiency.The type of telecom IC it uses is SUPPORT CIRCUIT.It is able to provide a lots of similar functions of the telecommunication product with the electronic parts under the SparX?-III-25um series.During normal operation, a minimum value of -40°C is set for the temperature.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.

VSC7422XJQ-04 Features


Available in the TQFP package
SUPPORT CIRCUIT as telecom IC type

VSC7422XJQ-04 Applications


There are a lot of Microchip Technology VSC7422XJQ-04 Telecom applications.

  • Home Gateway
  • T2 Rates PCM Line Interface
  • Routers
  • PDH Multiplexers
  • Wireless base stations
  • Digital Access Cross-connect System (DACs)
  • Fiber Optic Terminals
  • Intelligent PBX
  • Fiber
  • E1 Multiplexer