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VSC8254YMR-01

Telecom device2 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC8254YMR-01
  • Package: 256-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 376
  • Description: Telecom device2 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Mounting Type Surface Mount
Package / Case 256-BBGA, FCBGA
Supplier Device Package 256-FCBGA (17x17)
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 970mV 1.2V
Function Ethernet
Interface SPI
Number of Circuits 2
RoHS Status ROHS3 Compliant

VSC8254YMR-01 Overview


In order to save space on the board, the 256-BBGA, FCBGA package is used.Telecommunications equipment is packed using the Tray method.There is a type Surface Mount mount for this telecom circuit.An 2-circuit makes up this telecom IC .When the voltage for 970mV 1.2V is provided, improved efficiency can be achieved.

VSC8254YMR-01 Features


Available in the 256-BBGA, FCBGA package

VSC8254YMR-01 Applications


There are a lot of Microchip Technology VSC8254YMR-01 Telecom applications.

  • Add/Drop multiplexers (ADMs)
  • Cross Connects
  • Inverse Multiplexing for ATM (IMA)
  • T1 Rates PCM Line Interface
  • PBX (Private Branch Exchange)
  • Wireless local loop (WLL)
  • Central office (CO)
  • Wireless Local Loop
  • Fiber
  • Microwave transmission systems