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VSC8584XKS-11

256 TerminationsTelecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Origchip NO: 536-VSC8584XKS-11
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 222
  • Description: 256 TerminationsTelecom device1 Circuits(Kg)

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FedEx International, 5-7 business days.

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Details

Tags

Parameters
Factory Lead Time 7 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES
Packaging Tray
Published 2013
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 256
Max Operating Temperature 125°C
Min Operating Temperature 0°C
Voltage - Supply 1V
Terminal Position BOTTOM
Terminal Form BALL
Supply Voltage 2.5V
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
Function Ethernet
Temperature Grade OTHER
Interface GMII, SerDes, SPI, TBI
Number of Circuits 1
RoHS Status ROHS3 Compliant

VSC8584XKS-11 Overview


In order to save space on the board, 256-BGA packages are used.For telecommunications equipment packing, the Tray method is used.There is a type Surface Mount mount for this telecom circuit.Telecommunications equipment consists of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching configuration contains 256 terminations.With 2.5V as the supply voltage, it operates.To ensure normal operation, 0°C must be set at a minimum value.Normal operation is ensured by setting 125°C to the maximum value.

VSC8584XKS-11 Features


Available in the 256-BGA package

VSC8584XKS-11 Applications


There are a lot of Microchip Technology VSC8584XKS-11 Telecom applications.

  • Interfaces to DS3
  • Digital Modems
  • Home Gateway
  • Channel Banks
  • ISDN NT1/TA
  • Short/Medium Loop
  • T1/E1/J1 Performance Monitoring
  • Private branch exchange (PBX)
  • Fiber
  • SDH Multiplexers