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X66AK2H70XAAW24

4MB CPLD 66AK2H70 BGA


  • Manufacturer: Texas Instruments
  • Origchip NO: 815-X66AK2H70XAAW24
  • Package: BGA
  • Datasheet: -
  • Stock: 646
  • Description: 4MB CPLD 66AK2H70 BGA (Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

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Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Package / Case BGA
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Base Part Number 66AK2H70
Interface I2C, SPI, UART
Max Supply Voltage 1.1V
Min Supply Voltage 800mV
Memory Size 4MB
Number of I/O 32
RAM Size 32kB
Number of Timers/Counters 20
Core Architecture ARM
Max Frequency 1.4GHz
Number of Programmable I/O 32
Height 800μm
Length 38mm
Width 38mm
RoHS Status Non-RoHS Compliant

X66AK2H70XAAW24 Overview


An electronic component available in package BGA.It is possible to identify numerous related parts using the base part number 66AK2H70.This device operates at a voltage as low as 800mV.It is capable of receiving a maximum voltage of 1.1V.4MB data can be stored in the memory of this device.Timer/counters for measuring and counting external events are called 20 timers or counters.The processor core uses the architecture of the ARM processor.32 I/Os are included with the device.It is recommended to keep the operating temperature below 85°C.Temperatures should exceed 0°C during operation.Keeping the frequency below 1.4GHz will ensure reliability.A 32 programmable I/O is used for data transmission.

X66AK2H70XAAW24 Features


Supplied in the BGA package
20 timers/counters
32 I/Os

X66AK2H70XAAW24 Applications


There are a lot of Texas Instruments X66AK2H70XAAW24 DSP applications.

  • Consumer electronic gadgets
  • Receivers
  • Speech processing and recognition
  • Automobile electronic gadgets
  • Encoding/broadcast
  • 3D tomography and imaging processing
  • Biometrics
  • Monitoring equipment
  • Speech processing
  • Image compression