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XA7Z010-1CLG225Q

225 Terminations-40°C~125°C TJ 225 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 86 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XA7Z010-1CLG225Q
  • Package: 225-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 929
  • Description: 225 Terminations-40°C~125°C TJ 225 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 86 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 225-LFBGA, CSPBGA
Number of Pins 225
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 225
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Operating Supply Voltage 1V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 86
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
UV Erasable N
Height Seated (Max) 1.5mm
Length 13mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) are used in the construction of this SoC.According to the manufacturer, this system on a chip has a package of 225-LFBGA, CSPBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the Automotive, AEC-Q100, Zynq?-7000 XA series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 28K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.In total, this SoC part has 86 I/Os.The system on a chip uses 225 terminations in total.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.You will need to provide 11.8V power supplies in order to run system on chip.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.A wireless SoC that operates at a frequency of 667MHz is what the wireless SoC does.In terms of core architecture, the SoC meaning relies on ARM.The computer SoC is the 225-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.


XA7Z010-1CLG225Q System On Chip (SoC) applications.

  • Industrial transport
  • POS Terminals
  • Body control module
  • Keyboard
  • Special Issue Information
  • Optical drive
  • High-end PLC
  • DC-input BLDC motor drive
  • Medical Pressure
  • Functional safety for critical applications in the industrial sectors