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XA7Z010-1CLG400Q

400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XA7Z010-1CLG400Q
  • Package: 400-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 922
  • Description: 400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 400-LFBGA, CSPBGA
Number of Pins 400
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 400
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Operating Supply Voltage 1V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Primary Attributes Artix™-7 FPGA, 28K Logic Cells
UV Erasable N
Height Seated (Max) 1.6mm
Length 17mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.A MCU, FPGA technique is used for the SoC design's internal architecture.Featured system on chip SoCs of the Automotive, AEC-Q100, Zynq?-7000 XA series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.This SoC security combines Artix?-7 FPGA, 28K Logic Cells, an important feature to keep in mind.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 130 inputs and outputs.In total, there are 400 terminations, which makes system on a chip possible.This system on a chip is just as capable as any other high-quality Other uPs/uCs/Peripheral ICs.There is 11.8V power supply requirement for this system on chip SoC.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.667MHz is the wireless SoC's frequency.It uses ARM as its core architecture.The computer SoC has a pin count of 400.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.


XA7Z010-1CLG400Q System On Chip (SoC) applications.

  • Industrial Pressure
  • External USB hard disk/SSD
  • Healthcare
  • Multiprocessor system-on-chips (MPSoCs)
  • Smartphone accessories
  • Functional safety for critical applications in the automotive
  • DC-input BLDC motor drive
  • Samsung galaxy gear
  • Transmitters
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