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XA7Z020-1CLG400Q

400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XA7Z020-1CLG400Q
  • Package: 400-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 676
  • Description: 400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 400-LFBGA, CSPBGA
Number of Pins 400
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Operating Supply Voltage 1V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
UV Erasable N
Height Seated (Max) 1.6mm
Length 17mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 400-LFBGA, CSPBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Automotive, AEC-Q100, Zynq?-7000 XA series.Temperatures should be -40°C~125°C TJ on average for this SoC meaning.As one of the most important things to note is that this SoC security combines Artix?-7 FPGA, 85K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.The system on a chip uses 400 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Other uPs/uCs/Peripheral ICs.As far as power supplies are concerned, system on chip requires 11.8V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.At 667MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.Currently, the computer SoC is available in a 400-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.


XA7Z020-1CLG400Q System On Chip (SoC) applications.

  • Vending machines
  • Smartphones
  • Transmitters
  • Temperature Sensors
  • Industrial sectors
  • Industrial transport
  • Sports
  • Video Imaging
  • Published Paper
  • Body control module