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XA7Z020-1CLG484Q

484 Terminations-40°C~125°C TJ 484 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XA7Z020-1CLG484Q
  • Package: 484-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 212
  • Description: 484 Terminations-40°C~125°C TJ 484 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-LFBGA, CSPBGA
Number of Pins 484
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2009
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A991.D
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Operating Supply Voltage 1V
Power Supplies 11.8V
Interface CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Primary Attributes Artix™-7 FPGA, 85K Logic Cells
UV Erasable N
Height Seated (Max) 1.6mm
Length 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 484-LFBGA, CSPBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Automotive, AEC-Q100, Zynq?-7000 XA.This SoC meaning should have an average operating temperature of -40°C~125°C TJ.This SoC security combines Artix?-7 FPGA, 85K Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.It is really beneficial to have system on a chip since there are 484 terminations in total.As any high-quality Other uPs/uCs/Peripheral ICs, it is a system on a chip of outstanding capabilities.As far as power supplies are concerned, system on chip requires 11.8V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.During operation, the wireless SoC runs at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC has 484 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.


XA7Z020-1CLG484Q System On Chip (SoC) applications.

  • Sensor network-on-chip (sNoC)
  • Industrial automation devices
  • Communication network-on-Chip (cNoC)
  • Industrial robot
  • Samsung galaxy gear
  • Functional safety for critical applications in the industrial sectors
  • Robotics
  • Efficient hardware for inference of neural networks
  • High-end PLC
  • sequence controllers