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  • XA7Z030-1FBV484Q

XA7Z030-1FBV484Q

484 Terminations-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XA7Z030-1FBV484Q
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 272
  • Description: 484 Terminations-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~125°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
ECCN Code EAR99
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
JESD-30 Code S-PBGA-B484
Number of I/O 130
Speed 667MHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Assigned with the package 484-BBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.Automotive, AEC-Q100, Zynq?-7000 XA is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~125°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 130 I/Os in total.A system on a chip benefits from having 484 terminations.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

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