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  • XC17S150APD8C

XC17S150APD8C

Through Hole 1.5Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S150A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S150APD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 810
  • Description: Through Hole 1.5Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S150A (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S150A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 1.5Mb
Supply Current-Max 0.005mA
Organization 1040096X1
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S150APD8C Overview


An interesting 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.The voltage fed to it is 3V~3.6V.I have mounted this memory device in Through Hole.The size of data storage is limited to 1.5Mb.Try searching "XC17S150A" for more parts.There is a voltage requirement of 3.3V for supplying it with power.8 terminations with different functions.There is a maximum voltage of 3.6V that can be applied to this memory device.An operating voltage of 3V is required in order to supply the device.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at no higher than 225 degrees.The 8 pins are on the board.SERIAL-processing is used to transmit data through this memory using the SERIAL-processing algorithm.The memory chip is allowed to operate from a voltage no higher than 0.005mA.Parts include 8 pins.There is a configuration of COMMON for the memory's I/O.3.3V recommends that users apply 3.3V to the part before using it in a circuit so it can run safely and reliably.

XC17S150APD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S150APD8C Applications


There are a lot of Xilinx Inc. XC17S150APD8C applications of configuration proms for FPGAs.

  • telecommunications
  • embedded logic
  • printers
  • networking
  • data buffer
  • servers
  • personal computers
  • Camcorders
  • main computer memory
  • eSRAM