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XC17S200APD8I

Through Hole 2Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S200A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S200APD8I
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 217
  • Description: Through Hole 2Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S200A (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature -40°C~85°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S200A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 2Mb
Supply Current-Max 0.015mA
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S200APD8I Overview


A neat 8-DIP (0.300, 7.62mm) package is used.External packaging for the Tube series.Licensed to operate in -40°C~85°C.With the help of OTP, it can be programmed.This device is fed with a voltage of 3V~3.6V which is applied to it.Mounted in Through Hole is this memory device.Data storage is limited to a size of 2Mb bytes.Search "XC17S200A" for related parts.Supply voltage 3.3V is required.Various functions can be applied to 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.An example of a CONFIGURATION MEMORY memory chip can be seen in the picture below.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.There are 8 pins on it.Through SERIAL-processing, data is transmitted from this memory to the CPU.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.To run the part safely and stably in a circuit, 3.3V recommends users apply 3.3V on the part.

XC17S200APD8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200APD8I Applications


There are a lot of Xilinx Inc. XC17S200APD8I applications of configuration proms for FPGAs.

  • cell phones
  • telecommunications
  • personal computers
  • multimedia computers
  • data buffer
  • eSRAM
  • mainframes
  • personal digital assistants
  • networking
  • DVD disk buffer