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XC17S200APDG8C

Through Hole 2Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S200A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S200APDG8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 669
  • Description: Through Hole 2Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S200A (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S200A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 2Mb
Supply Current-Max 0.015mA
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S200APDG8C Overview


This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external use of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.A voltage of 3V~3.6V is applied to it.There is a memory device mounted in Through Hole position for this device.A maximum of 2Mb bytes of data can be stored.XC17S200A will give you other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.There are different functions associated with 8 terminations.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.A CONFIGURATION MEMORY memory chip is shown here.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.There are 8 pins on it.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate from a voltage no higher than 0.015mA.There is a set of 8 pins that are included with the part.A COMMON configuration is used for the memory's I/O.Prior to the use of the part in a circuit, it is recommended that users apply the 3.3V to the part so that the part will run as safely and reliably as possible.

XC17S200APDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200APDG8C Applications


There are a lot of Xilinx Inc. XC17S200APDG8C applications of configuration proms for FPGAs.

  • personal digital assistants
  • data buffer
  • supercomputers
  • embedded logic
  • eDRAM
  • servers
  • mainframes
  • workstations,
  • eSRAM
  • Cache memory