XC17S200APDG8I

XC17S200APDG8I Overview

The package uses a neat 8-DIP (0.300, 7.62mm) interface.Tube external packaging.A qualified individual who has the ability to operate within -40°C~85°C.OTP allows for programmability.The voltage fed to it is 3V~3.6V.There is a memory device mounted in Through Hole position for this device.FPGA is limFPGAed to 2Mb bytes for the size of the data storage.To find other similar parts, search for "XC17S200A".There is a requirement that it is supplied with a voltage of 3.3V.Various functions can be applied to 8 terminations.FPGA is possible to use this memory device at a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.The temperature should be kept below 250 in reflow soldering.FPGA is equipped wFPGAh 8 pins.SERIAL-process memory transmits data.For the memory chip to operate, it requires a voltage not exceeding 0.015mA.With the part are included 8 pins.Memory is configured as COMMON for memory's I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.

XC17S200APDG8I Features

Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200APDG8I Applications

There are a lot of Xilinx Inc. XC17S200APDG8I applications of configuration proms for FPGAs.

• multimedia computers
• embedded logic
• printers
• networks
• eSRAM
• main computer memory
• telecommunications
• DVD disk buffer
• workstations,
• Cache memory