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  • XC17S20XLPD8C

XC17S20XLPD8C

Through Hole 200kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S20XL not_compliant


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S20XLPD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 389
  • Description: Through Hole 200kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S20XL not_compliant (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S20XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 200kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Organization 179160X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Memory Density 179160 bit
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S20XLPD8C Overview


There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.The external packaging of Tube is made of Tube plastic.Licensed to operate in 0°C~70°C.This device can be programmed using the OTP language.A voltage of 3V~3.6V is applied to it.The memory device is mounted in Through Hole.The size of data storage is limited to 200kb.Look for "XC17S20XL" for other related parts.3.3V is the required supply voltage.There are different functions that can be applied on the 8 axis when it comes to terminating.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.An operating voltage of 3V is required in order to supply the device.Using MEMORY CIRCUIT memory chips, this is what you get.When soldering in reflow mode, the temperature should be kept below 225 at all times during the soldering process.8 pins are present.A memory chip can operate at a voltage no greater than 0.005mA.There is a set of 8 pins that are included with the part.I think it's important to point out that this is a memory IC that has a 10MHz frequency that can be operated at.The memory's I/O is configured to be COMMON in terms of its configuration.A power supply that is rated at 3.3V is recommended for use with this product.

XC17S20XLPD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S20XLPD8C Applications


There are a lot of Xilinx Inc. XC17S20XLPD8C applications of configuration proms for FPGAs.

  • workstations,
  • networks
  • servers
  • main computer memory
  • personal computers
  • cell phones
  • data buffer
  • multimedia computers
  • networking
  • telecommunications