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XC17S20XLVOG8C

Surface Mount 200kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S20XL


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S20XLVOG8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 755
  • Description: Surface Mount 200kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S20XL (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S20XL
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 200kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Organization 179160X1
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
Memory Density 179160 bit
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
RoHS Status RoHS Compliant

XC17S20XLVOG8C Overview


An interesting 8-SOIC (0.154, 3.90mm Width) package is used.External packaging of type Tray.As a qualified employee, I can operate within 0°C~70°C.FPGA is programmable through OTP.FPGA is fed wFPGAh a voltage of 3V~3.6V.The memory device is mounted in Surface Mount.A maximum of 200kb bytes of data can be stored.XC17S20XL will give you other related parts.3.3V is the voltage it requires as a supply.Different functions are associated with 8 terminations.This memory device can be used with a maximum voltage of 3.6V.3V is the minimum voltage required to supply the device.The memory chip in this picture is called a MEMORY CIRCUIT memory chip.The reflow soldering process should be done at a temperature no higher than 260.Pins on it are 8-shaped.A memory chip can operate at a voltage no greater than 0.005mA.The part comes with a set of 8 pins.Using a 10MHz frequency, this memory IC can work at high speeds.As far as memory I/O is concerned, it is configured as COMMON.A power supply that is rated at 3.3V is recommended for use with this product.

XC17S20XLVOG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S20XLVOG8C Applications


There are a lot of Xilinx Inc. XC17S20XLVOG8C applications of configuration proms for FPGAs.

  • workstations,
  • data buffer
  • main computer memory
  • hard disk drive (HDD)
  • eDRAM
  • personal computers
  • DVD disk buffer
  • servers
  • networks
  • printers