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  • XC17S30APD8C

XC17S30APD8C

Through Hole 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S30APD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 978
  • Description: Through Hole 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30 (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 300kb
Supply Current-Max 0.005mA
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S30APD8C Overview


There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packing on the outside is Tube.0°C~70°C license holder.The OTP programming language can be used to program it.A voltage of 3V~3.6V is applied to it.This memory device is mounted in Through Hole.Data storage is limited to 300kb bytes.To find other similar parts, search for "XC17S30".The supply voltage should be 3.3V.Different functions are associated with 8 terminations.With 3.6V as the maximum voltage, the memory device can be used.To supply the device, a minimum voltage of 3V is a must.The memory chip in question is a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.The memory chip operates at a voltage of no more than 0.005mA.With the part are included 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.

XC17S30APD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S30APD8C Applications


There are a lot of Xilinx Inc. XC17S30APD8C applications of configuration proms for FPGAs.

  • DVD disk buffer
  • cell phones
  • workstations,
  • personal digital assistants
  • personal computers
  • eSRAM
  • eDRAM
  • servers
  • graphics card
  • telecommunications