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  • XC17S30APD8I

XC17S30APD8I

Through Hole 300kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S30


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S30APD8I
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 950
  • Description: Through Hole 300kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S30 (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature -40°C~85°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 300kb
Supply Current-Max 0.005mA
Output Characteristics 3-STATE
Memory Width 1
Density 512 kb
Standby Current-Max 0.00005A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S30APD8I Overview


FPGA uses a neat 8-DIP (0.300, 7.62mm) package.Tube external packaging.An individual who is qualified to operate within the -40°C~85°C domain.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.The memory device is mounted in the Through Hole position.A maximum of 300kb bytes of data can be stored.Search "XC17S30" for related parts.3.3V is the voltage it requires as a supply.Various functions can be applied to 8 terminations.3.6V is the maximum voltage that can be used with this memory device.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.A CONFIGURATION MEMORY memory chip like this is used for data storage.If you're reflow soldering, you shouldn't go above 225.8 pins are located on the board.This memory transmit data in the SERIAL process way.The memory chip is allowed to operate at a voltage that is no greater than 0.005mA.Parts come with 8 pins.There is a configuration of COMMON for the memory's I/O.Before using the part in a circuit, it is recommended that the user apply 3.3V before the part is used in order to ensure that it runs safely and reliably in the circuit.

XC17S30APD8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S30APD8I Applications


There are a lot of Xilinx Inc. XC17S30APD8I applications of configuration proms for FPGAs.

  • printers
  • telecommunications
  • cell phones
  • hard disk drive (HDD)
  • multimedia computers
  • Cache memory
  • graphics card
  • servers
  • networking
  • mainframes