XC17S30ASO20C

XC17S30ASO20C Overview

FPGA uses a neat 20-SOIC (0.295, 7.50mm Width) package.Packaging for external use.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.There is a voltage of 3V~3.6V applied to the device.There is a memory device mounted in Surface Mount.The size of data storage is limited to 300kb.Look for "XC17S30" for other related parts.The supply voltage should be 3.3V.With different functions, 20 terminations can be used.A maximum voltage of 3.6V can be applied to this memory device.There must be a minimum voltage of 3V to supply the device with the power it needs.Using the CONFIGURATION MEMORY memory chip, we can store data.In reflow soldering procedure, the temperature should be controlled to no higher than 225.In this case, it has 20 pins.Data is transmitted in this memory using a SERIAL process.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.Parts include 20 pins.A COMMON configuration is used for the memory's I/O.The 3.3V company recommends that users apply 3.3V to the part before using it in a circuit so that it can run safely and reliably in the circuit.

XC17S30ASO20C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S30ASO20C Applications

There are a lot of Xilinx Inc. XC17S30ASO20C applications of configuration proms for FPGAs.

• telecommunications
• data buffer
• hard disk drive (HDD)
• networking
• Camcorders
• Cache memory
• servers
• workstations,
• main computer memory
• personal digital assistants