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  • XC17S30VO8C

XC17S30VO8C

Surface Mount 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30 not_compliant


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S30VO8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 636
  • Description: Surface Mount 300kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S30 not_compliant (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 4.75V~5.25V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 5V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30
Pin Count 8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25V
Power Supplies 5V
Supply Voltage-Min (Vsup) 4.75V
Programmable Type OTP
Memory Size 300kb
Operating Mode SYNCHRONOUS
Clock Frequency 10MHz
Supply Current-Max 0.01mA
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S30VO8C Overview


An interesting 8-SOIC (0.154, 3.90mm Width) package is used for this.External packaging of type Tube.A qualified individual who has the ability to operate within 0°C~70°C.With the help of OTP, it can be programmed.A voltage of 4.75V~5.25V is applied to it.This memory device is mounted in Surface Mount.Data storage is limited to 300kb bytes.In addition to this part, you can search "XC17S30" for other similar parts.The supply voltage should be 5V.Different types of 8 terminations are available with different functions.This memory device can be used with a maximum voltage of 5.25V.If the device needs to be supplied with power, then a minimum voltage of 4.75V is required.This is a MEMORY CIRCUIT memory chip.In reflow soldering, the temperature should be controlled to a maximum of 225 degrees during the process.There are 8 pins on it.The memory chip is allowed to operate at a voltage that is no greater than 0.01mA.Parts include 8 pins.FPGA is a 10MHz-frequency memory IC.There is a COMMON configuration for the memory's I/O.Memory is recommended that a 5V power supply be used.

XC17S30VO8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30VO8C Applications


There are a lot of Xilinx Inc. XC17S30VO8C applications of configuration proms for FPGAs.

  • data buffer
  • telecommunications
  • cell phones
  • personal digital assistants
  • supercomputers
  • multimedia computers
  • workstations,
  • embedded logic
  • printers
  • Cache memory