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  • XC17S30XLVOG8C

XC17S30XLVOG8C

Surface Mount 300kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S30XL


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S30XLVOG8C
  • Package: 8-SOIC (0.154, 3.90mm Width)
  • Datasheet: PDF
  • Stock: 364
  • Description: Surface Mount 300kb Mb Tray Configuration Proms for FPGAs 3 (168 Hours) OTP Obsolete XC17S30XL (Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tray
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S30XL
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 300kb
Clock Frequency 10MHz
Supply Current-Max 0.005mA
Output Characteristics 3-STATE
Memory Width 1
Standby Current-Max 0.00005A
I/O Type COMMON
Memory IC Type MEMORY CIRCUIT
Height Seated (Max) 1.2mm
Length 4.9mm
Width 3.9mm
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S30XLVOG8C Overview


An interesting 8-SOIC (0.154, 3.90mm Width) package is used.Packing on the outside is Tray.Qualified to perform a variety of tasks within the 0°C~70°C environment.Through OTP, it is programmable.With a voltage of 3V~3.6V, it is powered.Surface Mount is the orientation of this memory device.There is a limit of 300kb MB for the amount of data that can be stored.You can search "XC17S30XL" for other related parts.The supply voltage of the device must be 3.3V in order to operate correctly.Different functions are associated with 8 terminations.This memory device can be used with a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.Using MEMORY CIRCUIT memory chips, this is what you get.Reflow soldering should be done at 260°C maximum.In this case, it has 8 pins.The memory chip will not operate at a voltage above 0.005mA.With the part are included 8 pins.An IC that can work at 10MHz frequency is a memory IC.The I/O configuration of the memory is COMMON.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.

XC17S30XLVOG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30XLVOG8C Applications


There are a lot of Xilinx Inc. XC17S30XLVOG8C applications of configuration proms for FPGAs.

  • personal computers
  • nonvolatile BIOS memory
  • printers
  • eSRAM
  • networking
  • workstations,
  • mainframes
  • hard disk drive (HDD)
  • DVD disk buffer
  • eDRAM