XC17S40XLPDG8C

XC17S40XLPDG8C Overview

A neat 8-DIP (0.300, 7.62mm) package is used.Tube external packaging.Qualified to perform a variety of tasks within the 0°C~70°C environment.This device can be programmed using the OTP language.The voltage is 3V~3.6V.FPGA is mounted in Through Hole.There is a limit of 400kb MB for the amount of data that can be stored.Try searching "XC17S40XL" for more parts.3.3V is the required supply voltage.8 terminations with different functions.FPGA is possible to use this memory device at a maximum voltage of 3.6V.3V is the minimum voltage required to supply the device.The reflow soldering process should be done at a temperature no higher than 250.FPGA has pins on the 8 axis.A memory chip can operate at a voltage no greater than 0.005mA.There is a set of 8 pins that are included with the part.In terms of speed, this is a memory IC that operates at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended that a 3.3V power supply be used.The PROM memory is also referred to as the X memory.

XC17S40XLPDG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory

XC17S40XLPDG8C Applications

There are a lot of Xilinx Inc. XC17S40XLPDG8C applications of configuration proms for FPGAs.

• networks
• eDRAM
• DVD disk buffer
• supercomputers
• embedded logic
• mainframes
• networking
• personal computers
• data buffer
• printers