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XC17S50APD8C

Through Hole 500kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S50A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S50APD8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 599
  • Description: Through Hole 500kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S50A (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 8
ECCN Code EAR99
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S50A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 500kb
Supply Current-Max 0.015mA
Organization 559200X1
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

XC17S50APD8C Overview


FPGA uses a nice 8-DIP (0.300, 7.62mm) package that makes FPGA easy to use.External packaging of type Tube.A qualified individual who has the ability to operate within 0°C~70°C.With the help of OTP, it can be programmed.With a voltage of 3V~3.6V, it is powered.I have mounted this memory device in Through Hole.500kb is the maximum storage size.Other related parts can be found by searching "XC17S50A".The supply voltage of the device must be 3.3V in order to operate correctly.8 terminations with different functions.FPGA is possible to use this memory device wFPGAh a maximum voltage of 3.6V.There must be a minimum voltage of 3V to supply the device with the power it needs.The memory chip in this picture is called a CONFIGURATION MEMORY memory chip.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.FPGA is equipped wFPGAh 8 pins.In this memory, data is transmitted using the SERIAL process.An operating voltage of 0.015mA is allowed for the memory chip.As part of the package, the part comes with a set of 8 pins.A COMMON configuration is used for the memory's I/O.In order for the part to function safely and reliably as part of a circuit, 3.3V recommends that users apply 3.3V to the part prior to use in order to ensure that it will work properly.

XC17S50APD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50APD8C Applications


There are a lot of Xilinx Inc. XC17S50APD8C applications of configuration proms for FPGAs.

  • data buffer
  • networking
  • printers
  • eSRAM
  • eDRAM
  • cell phones
  • Camcorders
  • DVD disk buffer
  • embedded logic
  • networks