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  • XC17S50APDG8C

XC17S50APDG8C

Through Hole 500kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S50A


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC17S50APDG8C
  • Package: 8-DIP (0.300, 7.62mm)
  • Datasheet: PDF
  • Stock: 402
  • Description: Through Hole 500kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S50A (Kg)

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Details

Tags

Parameters
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Surface Mount NO
Number of Pins 8
Operating Temperature 0°C~70°C
Packaging Tube
Published 1999
JESD-609 Code e3
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Technology CMOS
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 250
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 2.54mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC17S50A
Pin Count 8
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Programmable Type OTP
Memory Size 500kb
Supply Current-Max 0.015mA
Organization 559200X1
Output Characteristics 3-STATE
Memory Width 1
Density 1 Mb
Standby Current-Max 0.001A
Parallel/Serial SERIAL
I/O Type COMMON
Memory IC Type CONFIGURATION MEMORY
Height Seated (Max) 4.5974mm
Length 9.3599mm
Width 7.62mm
Radiation Hardening No
RoHS Status RoHS Compliant

XC17S50APDG8C Overview


This package makes use of the 8-DIP (0.300, 7.62mm) programming language.Packaging for the external environment.In the state of 0°C~70°C, licensed to work.FPGA is programmable through OTP.The voltage is 3V~3.6V.This memory device is mounted in Through Hole.500kb is the maximum storage size.Look for "XC17S50A" for other related parts.In order for it to function, it requires a voltage supply of 3.3V.Various functions can be applied to 8 terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.3V is the minimum voltage required to supply the device.This is a CONFIGURATION MEMORY memory chip.The reflow soldering process should be done at a temperature no higher than 250.Pins on it are 8-shaped.Through SERIAL-processing, data is transmitted from this memory to the CPU.A memory chip can operate at a voltage no greater than 0.015mA.Parts come with 8 pins.A COMMON configuration is used for the memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.

XC17S50APDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50APDG8C Applications


There are a lot of Xilinx Inc. XC17S50APDG8C applications of configuration proms for FPGAs.

  • data buffer
  • main computer memory
  • mainframes
  • workstations,
  • supercomputers
  • embedded logic
  • personal digital assistants
  • cell phones
  • networks
  • DVD disk buffer