XC3S1400A-4FGG484C

XC3S1400A-4FGG484C Overview

There is a 484-BBGA package that includes this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. The device has 375 I/O ports for more coherent data transfer. The basic building blocks of logic contain 25344 logic elements/cells. It is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan?-3A seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. This device is equipped with 288 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. As a whole, it has 484 terminations. A device like this one offers 589824 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number XC3S1400A as a base. There is a maximum RAM si72kBe of 72kB on this FPGA module, which is necessary to ensure the normal operation of the program. Fpga electronics is designed wfpga electronics h 484 pins. A total of 2816 LABs/CLBs are included in this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. Power is supplied to the device by a 1.22.5/3.3V battery. A basic building block for this type of building block consists of 1400000 gates. A total of 484 pins are included in this device. A frequency of 250MHz provides high efficiency.

XC3S1400A-4FGG484C Features

375 I/Os
Up to 589824 RAM bits
484 LABs/CLBs
Operating from a frequency of 250MHz

XC3S1400A-4FGG484C Applications

There are a lot of Xilinx Inc. XC3S1400A-4FGG484C FPGAs applications.

• Military Temperature
• Image processing
• Secure Communication
• Enterprise networking
• ASIC prototyping
• Medical Electronics
• Military DSP
• Data Center
• Artificial intelligence (AI)
• Radar and Sensors