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  • XC3S1400AN-5FGG676C

XC3S1400AN-5FGG676C

1.2V V FPGAs Spartan?-3AN Series 676-BGA


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC3S1400AN-5FGG676C
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 715
  • Description: 1.2V V FPGAs Spartan?-3AN Series 676-BGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Supplier Device Package 676-FBGA (27x27)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2007
Series Spartan®-3AN
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.14V~1.26V
Base Part Number XC3S1400AN
Operating Supply Voltage 1.2V
Number of I/O 502
RAM Size 72kB
Number of Logic Elements/Cells 25344
Total RAM Bits 589824
Number of Gates 1400000
Number of LABs/CLBs 2816
Number of Logic Blocks (LABs) 2816
Speed Grade 5
RoHS Status ROHS3 Compliant

XC3S1400AN-5FGG676C Overview


Fpga chips is supplied in the 676-BGA package. A total of 502 I/Os allow data to be transferred in a more coherent manner. The basic building blocks of logic contain 25344 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.14V~1.26V , at which it runs. As part of the Spartan?-3AN series of FPGAs, it is a type of FPGA. The operating temperature should be kept at 0°C~85°C TJ when operating. A model of this FPGA is contained in Tray for the purpose of saving space. Fpga electronics is worth mentioning that this device provides 589824 bfpga electronics s of RAM. Its base part number XC3S1400AN can be used to find related parts. During the configuration of this FPGA module, the RAM si72kBe reaches 72kB to ensure that the program runs normally. In this case, 676 pins are used in the design. This FPGA is built as an array of 2816 LABs/CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. The maximal operating temperature of this module reaches 85°C. Over 0°C should be the operating temperature. 1400000 gates make up the basic block of its construction. There are 2816 logic blocks (LABs) that make up the system's basic building block. The device package supplied by 676-FBGA (27x27) is one of its suppliers.

XC3S1400AN-5FGG676C Features


502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
85°C gates
2816 logic blocks (LABs)

XC3S1400AN-5FGG676C Applications


There are a lot of Xilinx Inc. XC3S1400AN-5FGG676C FPGAs applications.

  • Industrial,Medical and Scientific Instruments
  • Ecosystem
  • Artificial intelligence (AI)
  • Digital signal processing
  • Embedded Vision
  • Medical Applications
  • Secure Communication
  • Development Boards and Shields for Microcontrollers
  • Telecommunication
  • Enterprise networking