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XC3S1500-5FGG676C

1.2V V 2.6mm mm FPGAs Spartan?-3 Series 676-BGA 1mm mm 676


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC3S1500-5FGG676C
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 192
  • Description: 1.2V V 2.6mm mm FPGAs Spartan?-3 Series 676-BGA 1mm mm 676 (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2008
Series Spartan®-3
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S1500
Pin Count 676
Number of Outputs 487
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Number of I/O 487
RAM Size 72kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 29952
Total RAM Bits 589824
Number of Gates 1500000
Number of LABs/CLBs 3328
Speed Grade 5
Height Seated (Max) 2.6mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant

XC3S1500-5FGG676C Overview


A 676-BGA package contains it, and it is available for download. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 487 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 29952 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. As part of the Spartan?-3 series of FPGAs, it is a type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A device such as this one has 487 outputs built into it. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has a total of 676 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 589824 bFpga chipss. XC3S1500 is the base part number that can be used to identify related parts. The RAM si72kBe of this FPGA module reaches 72kB so as to guarantee the normal operation of the program during operation. The device has 676 pins which are included in the design. Fpga electronics contains 3328 LABs/CLBs in an array. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Designers can fully utilize its flexibility with 1.2V supply voltage. Fpga semiconductor is made up of 1500000 gates as fpga semiconductors basic building block. With a total of 676 pins, it is equipped with a high level of security.

XC3S1500-5FGG676C Features


487 I/Os
Up to 589824 RAM bits
676 LABs/CLBs

XC3S1500-5FGG676C Applications


There are a lot of Xilinx Inc. XC3S1500-5FGG676C FPGAs applications.

  • Computer hardware emulation
  • Video & Image Processing
  • Wired Communications
  • Industrial IoT
  • Image processing
  • Automotive Applications
  • Bioinformatics
  • Voice recognition
  • Distributed Monetary Systems
  • Broadcast