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  • XC3S200AN-4FT256C

XC3S200AN-4FT256C

1.2V V 1.55mm mm FPGAs Spartan?-3AN Series 256-LBGA 1mm mm 256


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC3S200AN-4FT256C
  • Package: 256-LBGA
  • Datasheet: PDF
  • Stock: 902
  • Description: 1.2V V 1.55mm mm FPGAs Spartan?-3AN Series 256-LBGA 1mm mm 256 (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Spartan®-3AN
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3S200AN
Pin Count 256
Number of Outputs 160
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.33.3V
Number of I/O 195
RAM Size 36kB
Clock Frequency 667MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 4032
Total RAM Bits 294912
Number of Gates 200000
Number of LABs/CLBs 448
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.71 ns
Number of CLBs 448
Height Seated (Max) 1.55mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant

XC3S200AN-4FT256C Overview


The package that contains this software is called 256-LBGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. The basic building blocks of logic contain 4032 logic elements/cells. 1.2V volts power it. Field Programmable Gate Arrays family FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Spartan?-3AN seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 160 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. Total terminations are 256. Having a RAM bit size of 294912 means that this device will offer you a lot of memory. In order to find related parts, use the part number XC3S200AN as a base. It is crucial that the RAM si36kBe of this FPGA module reaches 36kB so that the program can run normally. The device has 256 pins which are included in the design. An array of 448 LABs/CLBs is built into the FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. An external power supply of 1.21.2/3.33.3V is required to power the device. The building block that forms the basis of the system contains 200000 gates. There are a total of 256 pins on this device. Most of the time, it uses a crystal oscillating at 667MHz to generate the signal. 448 CLBs are basic modules used for its architecture.

XC3S200AN-4FT256C Features


195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs

XC3S200AN-4FT256C Applications


There are a lot of Xilinx Inc. XC3S200AN-4FT256C FPGAs applications.

  • Medical Electronics
  • Broadcast
  • Industrial,Medical and Scientific Instruments
  • Automotive Applications
  • Aerospace and Defense
  • Device controllers
  • Scientific Instruments
  • Automotive advanced driver assistance systems (ADAS)
  • Solar Energy
  • Random logic