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XC3SD3400A-4FGG676I

2.6mm mm FPGAs Spartan?-3A DSP Series 676-BGA 1mm mm 676


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC3SD3400A-4FGG676I
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 905
  • Description: 2.6mm mm FPGAs Spartan?-3A DSP Series 676-BGA 1mm mm 676 (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Number of Pins 676
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2008
Series Spartan®-3A DSP
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC3SD3400A
Pin Count 676
Number of Outputs 409
Qualification Status Not Qualified
Power Supplies 1.22.5/3.3V
Number of I/O 469
RAM Size 283.5kB
Clock Frequency 250MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 53712
Total RAM Bits 2322432
Number of Gates 3400000
Number of LABs/CLBs 5968
Speed Grade 4
Height Seated (Max) 2.6mm
Length 27mm
Width 27mm
REACH SVHC Unknown
RoHS Status ROHS3 Compliant

XC3SD3400A-4FGG676I Overview


In the 676-BGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 469 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 53712 logic elements/cells. It is powered from a supply voltage of 1.2V. A Field Programmable Gate Arrays-series FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. This device is powered by a 1.14V~1.26V battery. This is a type of FPGA that is part of the Spartan?-3A DSP series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. With this device, you will be able to make use of 409 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. In total, it has 676 terminations on each end. This device has 2322432 RAM bits, which is the number of RAM bits that this device offers. In order to find related parts, use the part number XC3SD3400A as a base. The RAM si283.5kBe of this FPGA module reaches 283.5kB so as to guarantee the normal operation of the program during operation. Fpga electronics is designed wfpga electronics h 676 pins. This FPGA is built as an array of 5968 LABs/CLBs. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. In order for fpga electronics to work, fpga electronics requires a 1.22.5/3.3V power supply. The building block that forms the basis of the system contains 3400000 gates. Featuring 676 pins in total, it is a versatile device. Normally, fpga semiconductor uses an oscillator, which oscillates at 250MHz, to create the signal.

XC3SD3400A-4FGG676I Features


469 I/Os
Up to 2322432 RAM bits
676 LABs/CLBs

XC3SD3400A-4FGG676I Applications


There are a lot of Xilinx Inc. XC3SD3400A-4FGG676I FPGAs applications.

  • Industrial IoT
  • Distributed Monetary Systems
  • Automotive Applications
  • Automotive advanced driver assistance systems (ADAS)
  • OpenCL
  • Industrial,Medical and Scientific Instruments
  • Military Temperature
  • Telecommunication
  • Wired Communications
  • Automotive