XC7K70T-1FBG676C

XC7K70T-1FBG676C Overview

In the 676-BBGA, FCBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Its 300 I/Os help it transfer data more efficiently. A fundamental building block contains 65600 logic elements or cells. 1V volts power it. This FPGA part belongs to the family of Field Programmable Gate Arrays. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 0.97V~1.03V. It is a type of FPGA belonging to the Kintex?-7 seies. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 300 outputs were incorporated. As a space-saving measure, this FPGA model is contained within Tray. In total, there are a total of 676 terminations on fpga chips. As far as the RAM bits are concerned, this device offers you a total of 4976640. For related parts, use its base part number XC7K70T. During the configuration of this FPGA module, the RAM si607.5kBe reaches 607.5kB to ensure that the program runs normally. The device is designed with 676 pins in total. 5125 LABs/CLBs are integrated into this FPGA. Fpga electronics operates from a 11.83.3V power supply. As far as the pin count is concerned, it has 676 pins. Typically, it uses a crystal oscillating at 1098MHz in order to operate. There are 82000 registers used to store and transfer data.

XC7K70T-1FBG676C Features

300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
82000 registers

XC7K70T-1FBG676C Applications

There are a lot of Xilinx Inc. XC7K70T-1FBG676C FPGAs applications.

• Telecommunication
• Consumer Electronics
• Security systems
• Military Temperature
• Medical imaging
• Broadcast
• Electronic Warfare
• Embedded Vision
• Defense Applications
• Image processing