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XC7K70T-3FBG676E

2.54mm mm FPGAs Kintex?-7 Series 676-BBGA, FCBGA 1mm mm 676


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7K70T-3FBG676E
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 443
  • Description: 2.54mm mm FPGAs Kintex?-7 Series 676-BBGA, FCBGA 1mm mm 676 (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Kintex®-7
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number XC7K70T
Pin Count 676
Number of Outputs 300
Qualification Status Not Qualified
Power Supplies 11.83.3V
Number of I/O 300
RAM Size 607.5kB
Clock Frequency 1412MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 65600
Total RAM Bits 4976640
Number of LABs/CLBs 5125
Speed Grade -3
Number of Registers 82000
Combinatorial Delay of a CLB-Max 0.58 ns
Height Seated (Max) 2.54mm
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant

XC7K70T-3FBG676E Overview


Fpga chips is supplied in the 676-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 300 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 65600 logic elements/cells. The supply voltage is 1V volts. FPGA parts like this belong to the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 0.97V~1.03V supply voltage, fpga chips is able to operate at high speeds. As part of the Kintex?-7 series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. The device has 300 outputs that are integrated into it. In order to save space, this FPGA model has been contained in Tray. In total, it has a total of 676 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4976640 bFpga chipss. Related parts can be found by using its base part number XC7K70T. For the program to work properly, the RAM si607.5kBe of this FPGA module must reach 607.5kB GB in order to ensure normal operation. 676 pins are designed into the device. Fpga electronics contains 5125 LABs/CLBs in an array. It is powered by a 11.83.3V battery, which can be purchased separately. In addition to this, it has 676 pins. Typically, fpga semiconductor uses a crystal oscillating at 1412MHz . A total of 82000 registers are used for storing and transferring data between them.

XC7K70T-3FBG676E Features


300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
82000 registers

XC7K70T-3FBG676E Applications


There are a lot of Xilinx Inc. XC7K70T-3FBG676E FPGAs applications.

  • Medical Electronics
  • Digital signal processing
  • Industrial IoT
  • Data center hardware accelerators
  • Data center search engines
  • Scientific Instruments
  • High Performance Computing
  • Defense Applications
  • Space Applications
  • Electronic Warfare